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BGA Rework

Lead Free To Lead Conversion

Lead Free To Lead Conversion

  • BGA Remove and Placement
  • Level Three Pad Repair & Replace damaged BGA pads
  • ECO Wire Add
  • Circuit Trace Repair
  • BGA Reballing - Reattaching solder balls
  • Interposers - Cost effective method for converting lead-free BGA device
  • Double stacked components
  • Ball Grid Array Connectors
  • BGA Inspection X-Ray
  • PBGA (Plastic Ball Grid Array)
  • TBGA (Tape Ball Grid Array)
  • uBGA (Micro BGA)
  • CCGA (Ceramic Column Grid Array)
  • CBGA (Ceramic Ball Grid Array)
  • CPGA (Ceramic Pin Grid Array)
  • QFP (Quad Flat Pack)
  • SOIC (Small Outline Plastic Packages)
  • Lead Free RoHS BGA (Ball Grid Array)

BGA Removal & Rework

BGA X Ray Inspection Machine

 


Ask the BGA Experts
Lightspeed Manufacturing has long been a recognized leader in providing top-quality Ball Grid Array (BGA) services of all kinds, from assembly to component services (reballing) to rework. Our equipment includes top-of-the line BGA rework systems, and an experienced staff of technicians with in-depth knowledge and experience in BGA technology. Our range of services includes BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.
We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, µBGA, and all top-quality BGA services.


 

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